Something about the chip test

Any piece of integrated circuit is designed to complete a certain electrical characteristics of the function of the monolithic module, IC test is the test of integrated circuit, is to use a variety of methods, detection of those in the manufacturing process due to physical defects caused by the sample does not meet the requirements. If there were a defect free product, the IC testing would not be necessary. Due to the actual production process and the material itself more or less have some defects, so no matter how perfect the product will produce bad individuals, so testing has become one of the indispensable engineering in integrated circuit manufacturing.

IC tests are generally classified into Visual inspection Test, IC Functional Test, chemical corrosion cap testing (De-Capsulation), Solderbility Test, Direct current parameter (electrical performance) test (ElectricalTest), non-damaging internal wiring test (X-Ray), radioactive substance Environmental Standard test (Rohs) and failure analysis (FA) verification test.

First, IC electrical performance test

Analog circuit testing is generally divided into the following two types of testing, the first type is DC characteristic testing, mainly including terminal voltage characteristics, terminal current characteristics; The second type is AC characteristics test, these AC characteristics and the completion of the specific function of the circuit is closely related, such as a color processing circuit in the color decoding part of the color difference signal output, hue and other parameters are also very important AC test items.

Digital circuit test also includes DC parameter, switch parameter and special parameter of special function. It is necessary to test whether each logic gate and flip-flop work normally by using scan chain input test pattern. Common DC parameters such as high (low) level maximum input voltage, high (low) level input current, etc. Switching parameters include delay time, conversion time, transmission time, on-off time, and so on. Trigger special maximum clock frequency, minimum clock pulse width, etc. There are noise parameters and so on.

In terms of production process testing, IC testing is generally divided into chip testing, finished product testing and inspection testing, unless specifically required, chip testing is generally only DC testing, and finished product testing can have AC testing, can also have DC testing, in more cases, both kinds of testing. In a mass production line, inspection and testing is particularly important. It generally carries out the same content as the finished product test. It tests the finished product to be stored on behalf of the user, reflecting the supervision of the quality of the physical object and the working quality of the manufacturing department.

Two, IC test process

IC test generally it is divided into two parts: the first process and the second process.

Previous process

(1) The coarse silicon ore is converted into high purity monocrystalline silicon.

(2) Manufacture various IC components on Wafer.

(3) Test IC chip on Wafer.

Next step

(1) Slice (cut) Wafer

(2) Packaging and testing of IC chips.